無鉛錫膏
Lead-Free Solder Cream

採用無鉛未含鹵素之先進助焊劑及無氧超音製程球型錫粉所調配形成，並有絕佳的可靠性，所使用之助焊劑乃為低活化性無需清洗。

特點：

• 使用無鉛（錫、銀、銅系列）錫粉混合物，符合RoHS標準。

• 晶片側本少發生錫球。

• 印刷性非常安定連續使用粘度變化微少。

• 有極佳之焊接效果，對於元件之沾錫性有一之良好效應。

• 有氮、無氮均適合迴焊。

Lead-Free Solder Cream using Lead-Free manufactured with the atomized gas and centrifugal spraying methods, powder is fine, processes a truly special shape, lessoxidation and mized witrh high technical flux. Furthermore, excellent reliablilty can be obtianed with the flux without washing.

Features:

• Lead-Free (Sn/Ag/Cu series) solder alloy is use and RoHs Compliant

• Excellent printability with fine pallems can be obtained

• Stable printability is obtained with little change in viscosity during continous printing

• Having a good solderability, adequate wettability is shown on various parts.

• Can be used in ari-reflow and N2 reflow processes.